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Delta Polymers provides clients with electrically conductive epoxies. As an in-house manufacturer, we can customize these epoxies to best match your needs. Let's learn more about these electrically conductive epoxies and how they work.
High strength paste and film adhesives contain no solvents and are lead free. They are one part heat curing systems, which cure rapidly at moderate temperatures, require no mixing, dispense smoothly, streamline processing while avoiding waste. Special grades contain extremely small silver particle sizes, exceptionally thin bond lines, great thermal resistance and an excellent volume resistivity. Two part systems offer users convenient mix ratios, minimize thermal stress and are well suited to bond heat sensitive substrates.
Cures for these electrically conductive epoxies can be accelerated when curing at low temperatures. Flexible and low thermal coefficient of expansion adhesives are designed to adhere well to dissimilar substrates. Fast room temperature formulations set up in 10-20 minutes. Frozen syringes are available for two component epoxies. These compounds eliminate mixing errors, alleviate any waste, are bubble free and are ready to use after thawing out.
Electrically conductive epoxy film adhesives offer uniform bond line thickness, minimal squeeze out during bonding and a superior bond strength. These formulas have excellent toughness, good storage stability and will easily cure at moderate temperatures. When complete, the films can usually be cut into various shapes and sizes.
When exposed to atmospheric moisture, one component non-corrosive systems will cure at ambient temperatures. Paste viscosity materials have fast tack free speed, flexibility and high temperature resistance up to 400°F. This is perfect for use in bonding, gasketing, and EMI/RFI shielding. Low stress compounds adhere great to a wide variety of substrates, including other silicone surfaces.
Then there are addition cured two-part systems, which have convenient one to one mix ratios, long working life, low shrinkage and cure at ambient temperatures or more quickly at elevated temperatures. These types require no air for cross linking and the systems have tightly controlled viscosity. This feature allows for superior protection against exposure to moisture, vibration, thermal cycling. The end products will possess high elongation, will guard against corrosion, have excellent tensile strength and can be easily applied with automatic dispensing equipment.
Durable, resilient no mix systems will have a paste like consistency. This makes them highly effective for bonding, EMI/RFI shielding, and static dissipation. Curing elastomers feature good peel/shear strength properties. And their compositions are well suited for bonding dissimilar substrates. Overall, they perform well when exposed to thermal cycling, vibration, shock. Water and chemical resistance are also outstanding.
For electrically conductive sodium silicates, water-based systems are serviceable from 0°F to 700°F. One-part systems are easy to use for bonding, as well as EMI/RFI shielding. It is also highly effective as a moisture barrier. Apply these by using a brush or spray to plastic housings in order to protect electronic devices from excessive levels of interference. A level of interference that effects its normal operation.
For more information about the types of epoxies we manufacture and sell, please reach out to us today.
When you reach out, we can go over the various epoxies we manufacture, which include waterproofing membranes, floor coatings, and bonding compounds. Selecting the most appropriate chemical composition to meet your requirements is essential to getting the most desirable performance properties. With careful consideration given to viscosity, curing mechanisms, cure speed, strength, high/low temperature serviceability, shelf life, storage and more. And, most importantly for electrically conductive epoxies, the level of conductivity (volume resistivity). Understanding the tradeoff in values between these different chemistries is vital to satisfying your electronic packaging and assembly needs.